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Microvia: Key to Low-Cost and High-Density Interconnects
Course Code: OUSEP
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Description and objective: The first comprehensive and in-depth lecture to low-cost and high-density electronics packaging with microvia technologies. This course gives you cutting edge information on the most important new development and latest research results in applying the microvia technologies to printed circuit board and substrate for direct chip attach (DCA), e.g., flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in low-cost and high-density interconnects research and development, those who wish to master flip chip problem solving methods, and those who must choose a cost effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.
If you are involved with any aspect of the electronics industry, you should attend this course. The content is recommended for component, packaging, design, material, process, equipment, reliability, quality control, manufacturing, marketing, and sales engineers and managers.
For full details see http://www.conted.ox.ac.uk/ousep/
Contact Oxford University Technology - Electronics, Telecoms and Engineering Programme
| Phone | +44 (0)1865 286959 When calling be sure to mention Training Pages
| Fax | +44 (0)1865 286956 |
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