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Photonics Packaging, Physical Design for Reliability

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Description and objective: Some major problems, challenges, attributes and pitfalls in physical design and reliability of photonic packages are addressed, with an emphasis on the role and use of predictive modeling. Numerous practical examples are examined, and recommendations for materials selection and improved reliability are given. The course anticipates active interaction of the attendees with the instructor.
For further details: www.conted.ox.ac.uk/ousep

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